| 摘要 |
<p>A semiconductor plastic package having a structure which comprises a printed wiring substrate and a metallic sheet having the same size as that of the printed wiring substrate, provided at a generally central portion in the direction of the thickness of the printed wiring substrate, and insulated from a signal propagation circuit conductor on the surface of the printed wiring substrate by means of a thermosetting resin composition, the circuit conductor being electrically connected through a through-hole conductor to a circuit conductor formed on the back of the printed wiring substrate or a circuit conductor pad formed on the back for solder ball connection, and a semiconductor chip, a wire, and a bonding pad being encapsulated with resin, wherein at least one via hole is formed for the connection of the metallic sheet directly to the back, the inner wall of the via hole is a thermal conductor, a trapezoidal projection, conic metallic projections, or at least one via hole the inner wall of which is a thermal conductor is provided on the semiconductor chip mounting side. A method for producing a printed wiring substrate used for such a plastic package is also disclosed.</p> |
