| 摘要 |
<p>PURPOSE:To detect the contact between a cutter and a suction surface by constituting the suction surface from a porous ceramics, forming a conductive film on the surface, or forming the porous ceramics from an electric conductive ceramics and discharging the static electricity of a semiconductor wafer. CONSTITUTION:A vacuum suction device 1 forms a suction surface 2a by fixing a porous plate 2 on a substrate body 3, and a semiconductor wafer W, etc., are suction on the absorbing surface 2a through the vacuum suction by a suction hole 3a. The porous plate 2 consists of a porous ceramics which is formed to a conductive film by applying metal plating on the surface or a porous ceramics which possesses electric conductivity, and the suction surface 2a possesses electric conductivity. If the porous plate 2 is connected with a grounding 4, the static electricity generated on the semiconductor wafer W can be discharged. Further, when the electric conduction between a cutter 6 and the porous plate 2 is detected by a detector 5, the contact between the cutter 6 and the suction surface 2a can be easily detected, when cutting is completed, and the cutting-in of the cutter 6 to the suction surface 2a can be prevented.</p> |
