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发明名称
SOLDER ALLOY
摘要
申请公布号
KR100230269(B1)
申请公布日期
1999.11.15
申请号
KR19960080101
申请日期
1996.12.31
申请人
SAMSUNG ELECTRONICS CO, LTD.
发明人
AN, HYUNG KI;HAN, JAE HO;KIM, IN CHUL
分类号
B23K35/26;(IPC1-7):B23K35/26
主分类号
B23K35/26
代理机构
代理人
主权项
地址
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