PACKAGE

摘要

The package of the present invention comprises a base (11) molded integrally with a lead frame (12) by resin, a chip (14) mounted on the lead frame, and a cap (15) made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion (13a) sealing the lead frame therein, a frame-shaped bank portion (13b) formed at a periphery of an upper surface of said substrate portion, the bank portion (13b) having said lead frame interposed between it snd the substrate portion (13a), and an anchor portion (12a) formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.