A cast resin formulation useful for Glop, Top-flip, and/or adhesive applications in electrotechnical and electronic product manufacture

摘要

A cast resin formulation including a glycidyl ether containing resin and at least one other epoxide resin component with biphenylene and/or dicyclopentadiene structural elements is new. An Independent claim is also included for production of low distortion compounds, especially for electrotechnical and electronic building units, by partial or extensive coating of the cast resin formulation with the addition of a hardening component selected from a carboxylic acid anhydride and a conventional epoxide chemistry reaction accelerator, onto a substrate and hardening at increased temperature.