MODIFIED POLYAMIDE RESINS AND HEAT-RESISTANT COMPOSITIONS CONTAINING THE SAME

摘要

Modified polyamide resins obtained by reacting an epoxy-ended polyamide with an acid anhydride to thereby introduce carboxylate capable of reacting with epoxy resins into the resin skeleton. Compositions of these modified polyamide resins with epoxy resins provide adhesives showing excellent heat resistance after hardening. Further, adhesive tapes for semiconductors with excellent properties can be obtained by laminating the thus obtained adhesive and a protective layer onto one face of an organic insulating film.