发明名称 |
Verbindungsanordnung für elektrische Kontakte |
摘要 |
<p>Apparatus for electrically interconnecting a lead of an integrated circuit device to a terminal spaced at a distance from the lead, such as on a printed circuit board. The apparatus is also useful for interconnecting two printed circuit boards. The apparatus includes a housing which has at least two flanges extending therefrom. The flanges are spaced a distance with an elastomeric element captured thereby and extending therebetween. A conductive contact is mounted on the elastomeric element and thus freely suspended for contact with terminals to be interconnected. A multiplicity of such contacts may be arranged in a suitable pattern for interconnecting specified integrated circuit devices with a printed circuit board. The contact shape can be generally disk-like to provide maximum wiping action and to facilitate airtight contact between the terminal and interconnect apparatus. <IMAGE></p> |
申请公布号 |
DE69421008(D1) |
申请公布日期 |
1999.11.11 |
申请号 |
DE1994621008 |
申请日期 |
1994.06.22 |
申请人 |
JOHNSTECH INTERNATIONAL CORP., MINNEAPOLIS |
发明人 |
JOHNSON, DAVID A. |
分类号 |
H01R24/00;H01R12/71;H01R12/72;H01R13/24;H01R13/631;H01R33/76;H05K1/14;H05K1/18;H05K7/10;H05K7/14;(IPC1-7):H01R23/72 |
主分类号 |
H01R24/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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