发明名称 Verbindungsanordnung für elektrische Kontakte
摘要 <p>Apparatus for electrically interconnecting a lead of an integrated circuit device to a terminal spaced at a distance from the lead, such as on a printed circuit board. The apparatus is also useful for interconnecting two printed circuit boards. The apparatus includes a housing which has at least two flanges extending therefrom. The flanges are spaced a distance with an elastomeric element captured thereby and extending therebetween. A conductive contact is mounted on the elastomeric element and thus freely suspended for contact with terminals to be interconnected. A multiplicity of such contacts may be arranged in a suitable pattern for interconnecting specified integrated circuit devices with a printed circuit board. The contact shape can be generally disk-like to provide maximum wiping action and to facilitate airtight contact between the terminal and interconnect apparatus. <IMAGE></p>
申请公布号 DE69421008(D1) 申请公布日期 1999.11.11
申请号 DE1994621008 申请日期 1994.06.22
申请人 JOHNSTECH INTERNATIONAL CORP., MINNEAPOLIS 发明人 JOHNSON, DAVID A.
分类号 H01R24/00;H01R12/71;H01R12/72;H01R13/24;H01R13/631;H01R33/76;H05K1/14;H05K1/18;H05K7/10;H05K7/14;(IPC1-7):H01R23/72 主分类号 H01R24/00
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