发明名称 |
Perforated workpiece especially an optical or mechanical filter with micron or sub-micron size pores |
摘要 |
A perforated workpiece, comprising a silicon substrate (1) having a first region (6) with through-pores (4) and a second region (7) with blind pores, is new. An Independent claim is also included for producing a perforated workpiece by electrochemically etching one face (2) of a silicon substrate (1) to form pores (4) of depth less than the substrate thickness, providing the opposite substrate face (3) with a mask layer which exposes first regions (6) of this opposite substrate face, etching the exposed face regions (6) to the bottoms of the pores (4) and then removing the mask layer. |
申请公布号 |
DE19820756(C1) |
申请公布日期 |
1999.11.11 |
申请号 |
DE1998120756 |
申请日期 |
1998.05.08 |
申请人 |
SIEMENS AG |
发明人 |
LEHMANN, VOLKER;REISINGER, HANS;WENDT, HERMANN;STENGL, REINHARD;LANGE, GERRIT;OTTOW, STEFAN |
分类号 |
C25F3/12;C25F3/02;H01P1/20;(IPC1-7):B26F1/26 |
主分类号 |
C25F3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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