发明名称 Perforated workpiece especially an optical or mechanical filter with micron or sub-micron size pores
摘要 A perforated workpiece, comprising a silicon substrate (1) having a first region (6) with through-pores (4) and a second region (7) with blind pores, is new. An Independent claim is also included for producing a perforated workpiece by electrochemically etching one face (2) of a silicon substrate (1) to form pores (4) of depth less than the substrate thickness, providing the opposite substrate face (3) with a mask layer which exposes first regions (6) of this opposite substrate face, etching the exposed face regions (6) to the bottoms of the pores (4) and then removing the mask layer.
申请公布号 DE19820756(C1) 申请公布日期 1999.11.11
申请号 DE1998120756 申请日期 1998.05.08
申请人 SIEMENS AG 发明人 LEHMANN, VOLKER;REISINGER, HANS;WENDT, HERMANN;STENGL, REINHARD;LANGE, GERRIT;OTTOW, STEFAN
分类号 C25F3/12;C25F3/02;H01P1/20;(IPC1-7):B26F1/26 主分类号 C25F3/12
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