| 摘要 |
<p>A package and a corresponding method of forming this package is provided for surface mounting the semiconductor device to a board such that a first pad of the semiconductor device is operatively connected to a second pad on the board. The package includes a paddle having a front side and a back side with the front side being mated to the semiconductor device and at least partially enclosed in an encapsulant material and the backside being substantially exposed. In addition, the package has a region of the paddle that is at least partially isolated by the encapsulant material and aligned with the second pad, an interconnect connected to the first pad of the semiconductor device and bonded to the region such that a conductive path is formed with the first pad, the region and the second pad when the back side is mated with the board. In addition, a semiconductor package and a corresponding method of forming this package are provided where the semiconductor package includes a paddle and a semiconductor device mounted on the paddle. A passive electronic component is also mounted on the paddle and spaced apart from the semiconductor device. Interconnects provide a conductive path a conductive path from a bonding pad of the semiconductor device to a bonding pad of the passive electronic component such that the passive electronic component and semiconductor device are operatively connected.</p> |
