| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board of a structure, wherein the impedances between conductors for capacitance element connection and wiring conductors for power supply are set as a small value, whereby a charge can be fed satisfactory and rapidly from a capacitance element to the wiring conductors for power supply, and a semiconductor integrated circuit element, which is mounted on the wiring board, can be actuated always and normally. SOLUTION: A wiring board is formed into a structure, in which wiring conductors 3 and 4 for power supply connected with a semiconductor element 2 are buried between the insulating layers 1a and 1f of an insulating base body 1 formed by laminating insulating layers 1a to 1f and at the same time, conductors 11 and 12 for capacitance element connection, which are connected with a capacitance element 10, are adhered on the surface of the base body 1, and the wiring conductors 3 and 4 and the conductors 11 and 12 are connected with each other by conductors 16 to 19, at least two layers of insulating layers 1a and 1b are arranged between the conductors 11 and 12 and the wiring conductors 3 and 4 and conductors 14 and 15 for a relay of an area which is larger than that of the conductors 11 and 12 are formed between the layers 1a and 1b to connect the conductors 14 and 15 and the conductors 11 and 12 with each other through a first number of the through conductors 16 and 17, and to connect the conductors 14 and 15 and the wiring conductors 3 and 4 with each other through the through conductors 18 and 19 of a second number which is larger than that of the first number.</p> |
