| 摘要 |
PROBLEM TO BE SOLVED: To improve the wafer machining accuracy of a flattening device for machining the surface of the wafer. SOLUTION: In this device, an air cylinder device 94 for push-pressing a wafer 26 and a cup type grinding wheel 64 by a properly controlled pressure relatively is provided on a finish grinding stage 20. After driving this air cylinder device 94, the wafer 26 is ground while push-pressing the wafer 26 and cup type grinding wheel 64 by a controlled pressure. Thereby, as the grinding by the minute feeding which is difficult to reach in a screw feeding device is possible, the machined accuracy of the wafer 26 can be improved. |
