发明名称 WAFER FLATTENING DEVICE
摘要 PROBLEM TO BE SOLVED: To measure the worn amount of a grinding wheel or polishing cloth accurately without the drop of the efficiency of the grinding work of a wafer. SOLUTION: As the worn amount of cup type grinding wheels 54, 64 is measured by a non-contact type worn amount measuring instrument 68 consisting of a floodlight 70 and optical receiver 72, the worn amount measuring instrument 68 can be fixingly arranged to the position in which the polish of the wafer 26 by the cup type grinding wheels 56, 64 is not disturbed. As it is unnecessary that the worn amount measuring instrument 68 is moved to a measuring position at every measurement like the worn amount measuring instrument of a contact type like a limit switch and after finishing the measurement the worn amount measuring instrument 68 is moved to an original position, a polishing efficiency can be measured so as not to drop.
申请公布号 JPH11309666(A) 申请公布日期 1999.11.09
申请号 JP19980117335 申请日期 1998.04.27
申请人 TOKYO SEIMITSU CO LTD 发明人 ISHIKAWA TOSHIHIKO;KATAGIRI YASUSHI
分类号 B24B49/12;B24B37/00 主分类号 B24B49/12
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