DRY PROCESS METHOD FOR DEVELOPING AND STRIPPING PHOTORIESIST

摘要

PROBLEM TO BE SOLVED: To obtain a dry process method applied to printed circuits having extremely little influence of waste on the environment by providing the method with a stage for projecting particles of a polishing medium to a photoresist surface and removing the remaining photoresist, etc. SOLUTION: The photoresist is applied on the printed circuit board surfaces (stage a). Next, the photoresist is imagewise exposed by chemical rays to generate exposed regions and unexposed regions (stage b). The solid particles of the polishing medium are then projected to the exposed resist surface to remove the selectively exposed regions to obtain the exposed regions of the printed circuit boards (stage c). Further, the exposed regions of the printed circuit boards are treated with the material selected from etchant and chemicals for plating and their combination (stage d) and the entire part of the exposed photoresist is exposed with the chemical rays (stage e). The photoresist surface is then projected with the particles of the polishing medium to remove the remaining photoresist (stage f).