发明名称 |
Process for heat-treating substrate having film-forming composition thereon |
摘要 |
Firing process and apparatus for uniformly heat-treating a substrate having a film-forming composition thereon, wherein the substrate is subjected to a first soaking step in which the substrate is held for a predetermined time in a first heating chamber whose temperature is maintained at a first value, so that the temperature within the substrate is held at the first value evenly throughout an entire mass of the substrate, and after feeding of the substrate into a second heating chamber whose temperature is maintained at a predetermined second value which is different from the first value by a predetermined difference, the substrate is subjected to a second soaking step in which the substrate is held for a second predetermined time in the second heating chamber, so that the temperature within the substrate is held at the second value evenly throughout the entire mass of the substrate.
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申请公布号 |
US5980991(A) |
申请公布日期 |
1999.11.09 |
申请号 |
US19960735591 |
申请日期 |
1996.10.23 |
申请人 |
NORITAKE CO., LTD.;KYUSHU NORITAKE CO., LTD. |
发明人 |
SAKAMOTO, SUSUMU;OSHIMA, HIROSHI;MORI, HIROYUKI;ICHIHARA, HIRONOBU;SATO, YOJI |
分类号 |
B32B18/00;C03C17/00;C04B35/64;H05K1/03;H05K3/02;(IPC1-7):B05D3/02 |
主分类号 |
B32B18/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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