| 摘要 |
PROBLEM TO BE SOLVED: To realize the miniaturization of a semiconductor device, which has external connection electrodes brought into a state of higher density, and an increase in the density of the device, and moreover to provide a method of manufacturing the device and a method of manufacturing a lead frame. SOLUTION: In a semiconductor device constituted into a structure, in which the device is provided with a semiconductor element 11, a resin package 12 for encapsulating this element 11, metal films 13 exposed and formed in the packaging side surface 16 of this package 12 and wires 18, which electrically connect electrode pads on the element 11 with the films 13, stud bumps 17 to function as external connection terminals are respectively provided on the packaging side surfaces of the film 13. |
