发明名称 THERMAL HEAD
摘要 PROBLEM TO BE SOLVED: To prevent short circuit while enhancing heat dissipation by providing an anode oxide film on the surface of heat sink. SOLUTION: An anode oxide film 3 is formed on the surface of an aluminum heat sink 1. The anode oxide film 3 is formed at a thickness of 5-15μm by subjecting the aluminum heat sink 1 to anode oxidation through sulfuric acid bath or oxalic acid bath. The anode oxide film 3 is composed of alumina and exhibits high electric insulation. Alumina can be formed at low cost by anode oxidation and an oxide film can be formed easily and uniformly even at a part of intricate shape, e.g. a hole. The aluminum heat sink 1 is bonded to the rear surface of a metal substrate 5. Since the metal substrate 5 can be utilized as a power supply path of a heating element 9, power supply line can be eliminated and since alumina excellent in thermal conductivity is employed as an insulation film, a thermal head excellent in heat dissipation properties can be obtained.
申请公布号 JPH11309888(A) 申请公布日期 1999.11.09
申请号 JP19980117600 申请日期 1998.04.27
申请人 SHINKO ELECTRIC CO LTD 发明人 KUBOTA TAKASHI;HANAKI ATSUSHI
分类号 B41J2/335;(IPC1-7):B41J2/335 主分类号 B41J2/335
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