HIGH-MELTING POINT BALL CONNECTOR AND CONTACT THEREOF

摘要

PROBLEM TO BE SOLVED: To provide sufficient bonding strength and adequate mounting property of a bump grid array(BGA) package. SOLUTION: In a high-melting point ball connector having a housing 10 and a plurality of contacts 20 held on the housing 10, a solder ball 30 is welded to the connection 21 of each contact 20, and the housing 10 is provided with a holddown 40 which enhances mounting strength. A reinforcing solder ball 41 is welded to the holddown 40, and the solder ball 30 and the reinforcing solder ball 41 are matched in height.