| 摘要 |
<p>PURPOSE:To improve the manufacturing yield of a photocoupler by securing an insulating resin substrate between substrates having a plurality of photodetectors and cutting the substrate in a thicknesswise direction. CONSTITUTION:A substrate 25 is prepared similary to a semiconductor light emitting element substrate 21, an insulating resin substrate 29 is superposed on the back surface, P type regions 22, 26 are matched, and the substrates 21 and the 25 are bonded. Subsequently, the substrates 25, 29, 21 are cut in the thicknesswise direction between the P type region 26, thereby obtaining a light emitting element chip 30 having a P type region 22, a photodetector chip 31 having a P type region 26, and a photocoupler chip 33 made of resin 32. Then, a photocoupler is completed by securing the bump t the ribbon frame 34, bonding wires 36 to the electrodes 27, 28 on the surface of the chip 31, and molding it with resin 35.</p> |
