| 摘要 |
A semiconductor wafer polishing machine and method are described in which a motor driven rotating spindle is coupled to the wafer carrier by a flexible coupling element. The carrier is releasably attached to a load transfer plate by a vacuum pressure chamber to enable removal of the carrier for loading and unloading of wafers prior to and after polishing. The motor and spindle together with the load transfer plate and carrier are moved between and raised rest position and a lowered polish position by a positioning cylinder. A load pressure bellows applies a polishing load force to the load transfer plate through an air lubricated thrust bearing to urge the wafers on the carrier against a rotating polishing table for polishing the wafers. The air bearing isolates the load force of the bellows from the rotational force of the spindle and allows sliding movement of the load plate relative to the bellows. The carrier, load transfer plate and the polishing table may all be made of rigid foam material, such as metal or ceramic, in order to reduce the mass and weight of these elements while providing them with a strong rigid construction.
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