Uppvärmningsförfarande och mönsterkort

摘要

The present invention relates to a heating method and a printed circuit board comprising a heating element which generates heat required to heat printed circuit board components. The printed circuit board comprises heat conductor between the heating element and the component to be heated, the heat conductor receiving heat generated by the heating element and conducting the heat along the surface of the printed circuit board beneath the lower surface of the component to be heated. Furthermore, the printed circuit board comprises conductor parts which are narrower that the heat conductor, or which have a smaller cross-sectional surface area than does the heat conductor, and which restrict heat transfer away from the heat conductor to a component other than the one to be heated when the heat conductor functions as a ground plane or a signal path.