| 摘要 |
PROBLEM TO BE SOLVED: To achieve high efficiency and to connect the bonding pad of a semiconductor die to the terminal of a package mutually at the low cost, by performing the routing of the conductor of the first set, assigning the other part to the usable routing channel, and arranging the conductor of the second set. SOLUTION: A routing channel 40 has the segment located in a region 32 and the other segment in a region 31. These segments are linked by assigning the same node name to the segment. The segment in the region 32 is stored as the central point 46 located on an axis 47 between neighboring terminals 24. Since the axis 47 is located along the part where the regions 32 are most condensed, the conductor which is formed along the routing channel 40 can cross the region 32 when the sufficient interval where the routing channel 40 is contained between keep-out regions 45 is present along the axis 47. Therefore, the part where the regions are most condensed is recognized, and the crossing can be performed. |
