发明名称 |
Double window exhaust arrangement for wafer plasma processor |
摘要 |
A plasma ashing chamber that uses an external radiant power source to uniformly heat the wafer is provided with a double plate window through which radiant heat and exhaust gases flow without interfering with each other.
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申请公布号 |
US5980638(A) |
申请公布日期 |
1999.11.09 |
申请号 |
US19970790554 |
申请日期 |
1997.01.30 |
申请人 |
FUSION SYSTEMS CORPORATION |
发明人 |
JANOS, ALAN C. |
分类号 |
H01L21/302;H01J37/32;H01L21/027;H01L21/3065;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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