发明名称 Double window exhaust arrangement for wafer plasma processor
摘要 A plasma ashing chamber that uses an external radiant power source to uniformly heat the wafer is provided with a double plate window through which radiant heat and exhaust gases flow without interfering with each other.
申请公布号 US5980638(A) 申请公布日期 1999.11.09
申请号 US19970790554 申请日期 1997.01.30
申请人 FUSION SYSTEMS CORPORATION 发明人 JANOS, ALAN C.
分类号 H01L21/302;H01J37/32;H01L21/027;H01L21/3065;(IPC1-7):C23C16/00 主分类号 H01L21/302
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