| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board of a structure, wherein even if the wiring board is provided with a large number of through conductors as spares, the areas of wiring conductors for powder supply will not become into a narrow area, a power supply con be fed efficiently to a semiconductor integrated circuit element via wiring conductors for power supply, and the semiconductor integrated circuit element which can be mounted on the wiring board can be actuated satisfactorily. SOLUTION: This wiring board has such a structure that it is provided with a first insulating layer 1a, which has a mounting part A to be mounted with a semiconductor element 2 and electrodes for power supply for signal and for spare on the lower surface thereof on the upper surface thereof, and at the same time, has through conductors 3a, 5a and 6 for power supply, for signal and for spare respectively which are connected with the electrodes for power supply, signal and spare on the lower surface of the element 2, a second insulating layer 1b, which is laminated under the lower surface of the layer 1a and a wiring conductor 8 for power supply, which is provided between the layers 1a and 1b and is connected with the through conductors 3a. The wiring conductor 8 is formed on a region including the regions directly below the through conductors 6, and insulating films 11 are respectively provided between the conductors 6 and the conductor 8. |
