| 摘要 |
PROBLEM TO BE SOLVED: To provide a solar cell device free from the demerit of conventional devices that the forming an electrode of a light receiving surface side by a thick film method may cause a damage to the emitter. SOLUTION: By the method for manufacture of a solar cell device, a region 1a containing impurities of a conductivity type is formed on the major surface side of a semiconductor substrate 1 containing opposite conductivity type impurities. Then, a surface electrode 3 is formed on the major surface side and a rear surface electrode 4 is formed on the other major surface side. The surface electrode 3 is formed by applying a lower layer silver paste not containing glass frit and an upper layer silver paste containing glass frit to the surface and baking the silver pastes. |
