| 摘要 |
An apparatus for measuring the height of a solder wave having a supporting horizontal member, at least one elongated pin slidably affixed to the horizontal member extending vertically downward. The elongated pins have a sensing means affixed to it and the sensing means communicate with and indicator means to notify a technician the height of a solder wave relative to the top surface of the solder pot. The elongated pins with sensors attached thereto are set up to notify a technician if the solder wave is too low, too high, or at an optimum level. A screw and nut provide height adjustment for the elongated pins.
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