Regeneration method and apparatus of wafer and substrate

摘要

A method for regenerating a used wafer or substrate by removing a functional coating film formed on the used wafer or substrate, comprising the steps of: (a) a step for sorting the used wafer or substrate according to the quality, structure or thickness of the functional coating film; (b) a step for removing the functional coating film, while in a state of holding the used wafer or substrate, (i) by lapping the objective face of the used wafer or substrate with a hard metal-bonded whetstone while applying an electrochemical in-process dressing, (ii) by polishing the objective face while dropping a fine-particle polishing slurry between a polishing plate provided with a pad and the functional coating film, or (iii) by electrolyzing the functional coating film on the objective face placed opposite to an electrode face in an electrolyte solution at a predetermined voltage; (c) a step for mechanically removing the functional coating film adhered to the end face at an adequate stage; and (d) a step for washing and drying the used wafer or substrate after removal of the functional coating film.