| 摘要 |
An electrical circuit package including disk drive operation and control circuitry is formed in multiple layers, including a compliant circuitry layer coextensive with the package, and additional conductive and dielectric layers to form relatively stiff circuit panels bonded to the compliant layer and spaced apart from one another. Portions of the compliant layer, between confronting edges of adjacent circuit panels, provide compliant joinder segments. Each joinder segment electrically couples its associated pair of circuit panels, and structurally couples the panels in a manner that permits a selective, non-coplanar orientation of the panels relative to each other. Thus, the panels are electrically and structurally coupled in a manner that facilitates testing the circuit package as a single unit, followed by installation of the package to a disk drive housing with the circuit panels integral with the housing and in the desired non-coplanar arrangement. The non-coplanar arrangement increases area available for supporting semiconductor components. Selectively arranging the components over the available panel surface area facilitates heat dissipation. Selective shaping and positioning of the panels about the housing enables the housing to accommodate full height actuator and spindle motors.
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