| 摘要 |
PROBLEM TO BE SOLVED: To polish by the small circular movement of polishing discs, without the rotation of the polishing disc. SOLUTION: Polishing discs 15, 25 are contacted to both surfaces of a work 68, while separating them relatively by an approach/separate means 30 and approaching relatively after setting the work 68 to a holding carrier 60. The polishing discs 15, 25 are rotated eccentically by an eccentically turning means 50 and polish both surfaces simultaneously. By the eccentically rotating means 50, eccentric axial centers 14A, 24A can be displacingly rotated around the support axial centers 10A, 20A and the polishing discs 15, 25 are displacingly rotated by a small circle around the support axial centers 10A, 20A without rotating and the contact of the polishing discs 15, 25 for the work 68 is carried out uniformly at entire both surfaces and with a constant polishing speed. The polishing discs 15, 25 can offset the lateral direction load by processing. |
