| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device, wherein the occurrence of short due to displacement of wire bonding or due to the flow in of conductive resin or paste at a flip chip is settled. SOLUTION: On a substrate 1 one conductive type semiconductor layer 2 and a reverse conductive type semiconductor layer 3 are laminated and coated with an insulating film, and a common electrode 5 is provided near facing end part of the substrate 1 for connection to the one conductive type semiconductor layer via a first connection line 7, while an individual electrode 4 is provided inside the common electrode 5 for connection to the reverse conductive type semiconductor layer 3 via a second connection line 8. Here, the common electrode 5, the connection line 7, and the second connection line 8 are covered with a second insulating film of film thickness 100-3,400 Å. |
