发明名称 |
Adhesive and encapsulating material with fluxing properties |
摘要 |
The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chemical cross-linking agent which has fluxing properties but which is unreactive or of severely restricted reactivity with the polymer without the action of heat and/or catalyst. The composition is to be thermally curable when heated to soldering temperatures in a reaction which is catalyzable merely by metal oxide fluxed from metal surfaces by cross-linking agent then dissolved in the thermosetting polymer. |
申请公布号 |
AU3617999(A) |
申请公布日期 |
1999.11.08 |
申请号 |
AU19990036179 |
申请日期 |
1999.04.22 |
申请人 |
MULTICORE SOLDERS LIMITED;HUGH PATRICK CRAIG |
发明人 |
HUGH PATRICK CRAIG;DAVID JOHN JAMES LOWRIE |
分类号 |
B23K35/363;C08G59/18;C08G59/40;C08G59/42;H01L21/56;H01L21/60;H01L23/29;H01L23/31 |
主分类号 |
B23K35/363 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|