| 摘要 |
<p>The invention is directed to a method of fabricating a pellicle cover assembly for use in a projection printing system for forming an image on a radiation sensitive wafer, the method comprising the steps of applying a gold film onto the surface of a wafer, applying a polymer film onto the gold film surface, curing the polymer film, adhering a support ring to the polymer film, cutting through the polymer and gold films between the ring and wafer edges to expose the wafer surface, peeling the ring off the wafer and etching off the gold film.</p> |
