| 摘要 |
PROBLEM TO BE SOLVED: To narrow an inner lead pitch, while ensuring the strength of an outer lead by plating the inner lead with a noble metal for wire bonding after outer shape processing is performed by two-step etching, and by adhering a fixing tape. SOLUTION: By two-step etching, an lead frame 110A is integrally extended to the leading edge of an inner lead 112 to connect the leads with a connecting part 117 and its outer shape is processed. The inner lead extremity of the lead frame 110A is plated with silver for wire bonding. Then, a fixing tape 130 is adhered astride the adjacent inner leads 112, including a part of the leading edge and a part of the connected connecting part 117. The connecting part 117 is punched out with the fixing tape 130 from the leading edge of the inner lead 112. Therefore, down set process is performed as needed, and when a die pad 111 is brought lower than the position of the inner lead 112, the pitch of the inner lead can be narrowed, while ensuring the strength of an outer lead. |
