| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency wiring board which can be miniaturized, superior in transmission characteristic, and usable for a system which includes an antenna device and a semiconductor device for microwave or millimeter waves. SOLUTION: A high-frequency semiconductor package 1 or a wiring board, which is formed of dielectric materials 2 and 3 laminated interposing a grounding layer 10 between them is equipped with a first signal transmission line 8 whose one end is electrically connected to a semiconductor device 7, a grounding layer 10 arranged inside an insulating layer 4, and a second signal transmission line 9 formed on the rear of the insulating layer 4, wherein the other end of the first signal transmission line 8 is coupled electromagnetically with the other end of the second signal transmission line 9 via a slot hole 11 provided to the grounding layer 10, and a dielectric material is used so as to make a permittivity ε1 of an insulating layer 2 located between the first signal transmission line 8 and the grounding layer 10, larger than a permittivity ε2 of an insulating layer 3 located between the second signal transmission line 8 and the grounding layer 10. |
