| 摘要 |
PROBLEM TO BE SOLVED: To improve mass productivity of a semiconductor device and select only either of chips, by storing a plurality of chips, which are connected to a lead with their major planes facing each other, in one package. SOLUTION: Major planes are arranged to face each other with the major plane 1a of a chip 1 facing top and the major plane 4a of a chip 4 facing down. The electrode pads 2 and 5 of the pair of chips are connected to a lead 7 common to the pair of chips via electrode bumps 3 and 6, the chips are fixed with adhesive 8a and 8b and are sealed with a resin 9 to be stored in one package. An electrode bumps 3 are formed on the surface of the electrode pad 2 excluding an electrode pad 2q2 for ICE, and the electrode pad 2 of the first chip 1 is bonded to the edge of the lead 7 via the electrode bumps 3 by thermocompression bonding. Therefore, high volume productivity is obtained by constituting a resin-sealed semiconductor device, which can select only either of the chips, by using the two chips whose electrode pads are arranged at the same position. |
