| 摘要 |
PROBLEM TO BE SOLVED: To uniformly treat the entire peripheral edge of a wafer as well as other parts than the peripheral edge, when immersing and treating a plurality of wafers at once, using a wafer carrier. SOLUTION: Rotary rollers 40 are provided on the bottom face of a treating tank 30 containing a treating liquid 31 and contacts a wafer 10 in a carrier 20 via a bottom face opening of the carrier 20, when the carrier 20 is set in the treating tank 30, the rotary rollers 40 are disposed parallel at both sides of a vertical plane involving the center line of the wafer 10 in the carrier 20 and rotated to spin the wafer 10 in the carrier 20 in the circumferential direction during treating, and this spinning uniformly treats the entire peripheral edge of the wafer 10, fitted in the slot of the carrier 20, similarly to parts other than the peripheral edge. |
