| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability on the heat cycle by bonding a ceramic sintered body to the opposite side face of a bonded base Cu plate to suppress the warpage of the circuit board, when bonding the base Cu plate to the circuit board about the circuit board to which the base Cu plate is bonded. SOLUTION: A metal circuit and metal heat sink are formed on one and opposite surfaces of a ceramic circuit board, a base Cu plate is bonded to the metal heat sink, a ceramic sintered body is bonded to the base Cu plate, the material of the ceramic sintered body is preferably one having a high thermal conductivity and especially preferably Al nitride, etc., the thickness is preferably 0.3-2 mm and exp. the distance between the periphery of the ceramic sintered body and that of the base Cu plate is desirably about 1-3 mm. Thus it is possible to greatly reduce the assembling of a power module and obtain an electronic component having a circuit board superior in heat resistance against cycle. |
