| 摘要 |
PROBLEM TO BE SOLVED: To uniformize the electrical performance of a high frequency package and to improve the performance of a connecting part by connecting high frequency circuits of oppositely arranged printed boards to each other contactlessly by using a waveguide. SOLUTION: Printed boards 1a and 1b having signal lines 7a and 7b are fixedly provided on the bases 6a and 6b of upper and lower packages respectively and both the packages are overlapped. The boards 1a and 1b pass through side wall parts 4a and 4b at sealing parts 2a and 2b and extend into a waveguide 13 formed by a cover 3 and the side wallparts, converting parts 8a and 8b are provided thereon, the distances between each converting part 8a and 8b and termination planes 12a and 12b of the waveguide 13 respectively takes 1/4 wavelength λ of use frequencies and the inner diameter dimension of a cross-section of the waveguide 13 is defined in accordance with the use frequencies. |
