发明名称 HEATING AND BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable high accuracy, reliable temperature control by holding the top surface of a heat block, holding a body to be bonded consisting of an optical fiber inserted into the through hole of a ferrule through a thermosetting adhesive and the ferrule at nearly uniform temperature without causing any temperature unevenness. SOLUTION: In this device, a heater 4 is housed nearly horizontally to overall length along the length in a heat block part 3 supporting a heated block 2, where hold parts 2a holding ferrules F1 are arranged side by side. A control part 6 controls the heater 4 according to the temperature detected by a temperature sensor 5 provided on the flank of the heat block part 3 nearby the lengthwise center part of the heater 4.
申请公布号 JPH11305062(A) 申请公布日期 1999.11.05
申请号 JP19980112532 申请日期 1998.04.22
申请人 SEIKO INSTRUMENTS INC 发明人 HIRAYAMA NAOYUKI;TOKITA HIROYUKI
分类号 G02B6/255;(IPC1-7):G02B6/255 主分类号 G02B6/255
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