PROCESS MONITORING METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To measure the film thickness distribution on a processed base substance which is loaded on a plasma CVD device. SOLUTION: A measurement region in a specific area is irradiated with a white color light from a light source 11 through the intermediary of a half mirror 12 and a lens 13, while the reflected light from the measured region 10 enters a spectroscope 14 through the intermediary of the lens 13 and the half mirror 12. With such a constitution, the reflected light passing through the spectroscope 14 enters a two-dimensional CVD 15 which is further connected to a data processor 16.