发明名称 CONDUCTIVE PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To make adjustment of a conductor resistance of a conductive pattern easy by more than two kinds of insulated surface processing metallic particles which include metal and its oxide or one of these transferring to a ceramic green sheet corresponding to an image formed by an electronic photography and heating. SOLUTION: Two kinds of insulated surface processing metallic particles such as metal as copper, tungsten and so on, ruthenium oxide and so on are contained in a developing member 17 having a mean particle diameter of 3 to 10μm and a resistance of 1×10<13> to 10<14>Ω.cm at a weight ratio within a range of 1:99 to 99: 1. After that a photosensitive body 11 which is made exposure processing by a whole surface exposure member 23 is charged by a charging member 13 in the dark. A latent image of a required conductive pattern is formed on the photosensitive body 11 by an image signal exposure member 15. After that the photo sensitive body 11 is developed and is transferred on a ceramic green sheet supplied between a transfer member 19 while a developing value and a dot density of more than two kinds of the insulates surface metallic particles are adjusted. Additionally the conductive pattern is formed by heating the sheet at more than a melting point of the metal and so on.
申请公布号 JPH11307911(A) 申请公布日期 1999.11.05
申请号 JP19980110509 申请日期 1998.04.21
申请人 KYOCERA CORP 发明人 KOUDAKA HISASHI;ISHII MASAKI
分类号 H01G4/30;H05K3/10;(IPC1-7):H05K3/10 主分类号 H01G4/30
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