| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating spacer having high flexibility and high thermal conductivity. SOLUTION: A heat dissipating spacer contains 40 to 60 vol.% thermally conductive filler in which a volume ratio of zinc oxide powder of 0.3 to 1μm in average grain diameter to silicon nitride powder of 10 to 50μm in average grain diameter is (0.5:9.5) to (3:7), and 60 to 40 vol.% addition polymerization- type liquid silicone solid, having 2 W/m.K or above in thermal conductivity, and Asker C hardness of 50 or below.
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