| 摘要 |
PROBLEM TO BE SOLVED: To provide the bonding tool and the bonding device, for electronic components, which is capable of securing the parallel accuracy of a compression bonding surface and obtaining the stabilized bonding quality. SOLUTION: In the bonding device for electronic components, which compresses the bump of the electronic component to the surface under compression by a bonding tool, an attaching seat 15a, which is formed as a unitary body with a horn 15 and has a plane in parallel with a compression bonding surface 15f, is provided at the position in correspondence with the node of the standing wave separated by equal distance to both-end sides of the horn 15 from the surface 15f for compressing the electronic component at the symmetrical arrangement for the central line in the longitudinal direction of the horn 15 of the bonding tool 14. This attaching seat 15a is brought into contact with the attaching plane at the lower surface of a block and fixed. Thus, the parallel accuracy of the surface 15f can be secured with good reproducibility without requiring complicated adjustment. |
