| 摘要 |
PROBLEM TO BE SOLVED: To dry a semiconductor wafer in a short time by arranging a gas nozzle which shoots up inert gas diagonally downward above a chuck, so that a tip thereof moves outward in a radial direction from a central part of a semiconductor wafer. SOLUTION: A supply nozzle 6 of washing liquid to an upper surface of a semiconductor wafer 4 which is chucked by vacuum to an upper surface of a chuck 5 is arranged thereabove. A gas nozzle 7 which shoots up inert gas is arranged to tilt diagonally downward at a proper angleθ1 to an upper surface of the semiconductor wafer 4 and to tilt by a proper angle outward to a normal extending to a radial direction from a rotation center of the semiconductor wafer 4. A tip of the gas nozzle 7 is constituted to move from a central part of the semiconductor wafer 4 to an outside in a radial direction by a reciprocating head 9.
|
