| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device housing package for effectively preventing resin, which forms an insulating board from adhering to outer lead terminals attached to the insulating board, and surely, firmly, and electrically connecting the electrodes of a semiconductor device to the outer lead terminals through bonding wires. SOLUTION: A lower die 8 equipped with a recessed groove 8a on its upside and a protrudent part 8b which is arranged around the recessed groove 8a is made to bear against an upper die 9 provided with recessed grooves 9a arranged on its underside pinching outer leads 5 between them in a vertical direction, the outer leads 5 are fixed between the dies 8 and 9, the one end 5a of each lead 5 is located in a cavity A formed by the recessed grooves 8a and 9a and the other of the ends 5a so as to be joined to the upside of the upper die 9 exposed inside the cavity A, and then liquid resin P is poured into the cavity A and made to cure. |
