| 摘要 |
PROBLEM TO BE SOLVED: To effectively avoid forming voids in an insulation base, hermetically seal a semiconductor element with the insulation base and cover and cleanly and stably operate the semiconductor element for a long time by providing a main space and sub-space which communicates with the main space in a die. SOLUTION: When being abutted against up and down, a lower and upper dies 8, 9 are prepared in which a main space A fitted to an insulation base and sub-space (a) communicating with the main space A are formed. Between the lower and upper dies 8, 9 a plurality of outer lead terminals 5 are sandwiched and a butted up and down to secure the outer lead terminals 5, and one end of each outer lead terminal 5 is abutted to the upper die 9 in the main space A. A liquid resin is poured into the main space A to form an insulation base and when the liquid resin is poured into the main space A to form the insulation base, the air in the main space A is pushed by the poured liquid resin into the sub-space (a) to avoid involving the liquid resin. As a result, no void is formed in the insulation base and it becomes compact. |
