| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent metal fatigues caused by the difference in thermal expansion coefficients of each parts, and to prevent the occurrence of solder stripping of an outer lead by lengthening the length of the outer lead. SOLUTION: The lead length of an outer lead 1a becomes longer than the conventional gal wing formed outer lead in this semiconductor device. For example, the outer lead is formed into a Z-shape, and the length from the side face of a resin encapsulating body 1b to the first bending part is longer than the length from the third bending part to lead end part. The dimension and the angles 1c to 1h of each part are such as to satisfy the specifications of flat package having a conventional gull-wing type lead.</p> |
