| 摘要 |
<p>PROBLEM TO BE SOLVED: To bond electrode projections reliably and with good working efficiency by providing a bare chip fixation stand with recessed sections, each of which has a slant section that gradually becomes deeper toward the center and has a horizontal cross-sectional shape similar to the flat shape of a bare chip at each position in the depth wise direction. SOLUTION: A bare chip fixation stand 1 has on the upper surface of its plate-like body a recessed sections 2 formed in three lines and three ranks. Each of the recessed sections 2 has a rectangular shape to store a bare chip 3. At the center of the bottom face of it, a suction hole 4 is formed. Around the suction hole 4, a slant section 4 is formed. The slant section 4 is constituted of four slant faces 6 corresponding to each side of the bare chip 3. Each of the slant face 6 has an angle of 45 deg. with respect to the horizontal face. The horizontal cross-sectional shape of the slant section 5 is similar to the flat shape of the bare chip 3 at each position in the depth wise direction. As a result of this method, electrode projections can be bonded precisely.</p> |
