| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a single wafer spin drying apparatus for a semiconductor wafer in which the semiconductor wafer is chucked at the center position of the rotary table stably and firmly by a mechanical force. SOLUTION: This apparatus is provided with a table rotary tube 6, a nozzle shaft 10, a motion converting/transmitting mechanism 17-30 which rotates the nozzle shaft 10 through a constant angle, a plurality of chucking shaft 13, plural chucking jaws 16 having chucking parts (16c). When the nozzle shaft 10 is rotated through a constant angle by the motion converting/transmitting mechanism, the chucking shaft 13 extends to the circumferential direction of a rotary table 2 and rotates the chucking jaws 16, and the chucking parts (16c) at the end holds the outer peripheral edge of the wafer 1. Then, when the nozzle shaft 10 turns to the its original position, the chucking shaft 13 is retracted toward the central of the rotary table 2 and rotates the chucking jaw 16c reversely, and the chucking of the wafer 1 by the chucking part (16c) is released.</p> |
