| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness of radiation layers, to form patterns of the radiation layers more easily and to prevent deformation of the patterns of the radiation layers at the time of lamination. SOLUTION: A laminate is formed by stacking copper foil for radiation on one side of insulating plates 23A and 23B and copper foil for circuits on the other side and integrating them. Radiation layers 24A and 24B with desired patterns are formed by eliminating by etching unnecessary parts of the copper foil for radiation by the laminate. Also, circuit conductors 3A and 3B with desired patterns are formed by eliminating by etching unnecessary parts of the copper foil for circuits. In this way, substrate 21A and 21B with radiation layers are obtained. The substrate 21A and 21B with radiation layers are stacked through a prepreg 6A. Sheets of copper foil 26A and 26B are stacked on both sides of the substrates 21A and 21B through prepregs 6B and 6C and integrated. After peeling supporting plates 25A and 25B, the copper foil 26A and 26B is pattern etched for forming circuit conductors. |
