MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor devices, in which generation of thin burr is almost suppressed in resin molding by guiding a thermal resistant and soft material between hardware for resin molding and exposure for lead frames. SOLUTION: In a resin molding process for a frame, a wire-bonded semiconductor device 10 is loaded in a hardware 20 in a resin molding process; i.e., a frame 10 is fixed in a hardware 20. After heat-treated, a liquefied resin is poured from a resin injector to the hardware 20, and is resin-molded depending on the temperature profile. For the resin, thermosetting resin, such as molding resin mainly composed of epoxy-based resin for example, is used. In a metallic fin-exposed semiconductor device, spacing between the hardware 20 and fin- exposed parts 23 can be exposed clearly by using a thermal resistant and soft material between the hardware 20 and the fin-exposed parts 23.